Product Range
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Lapping Machine
Features
Set a stability by substantial & simple frame
Low breakage-rate during process
Automatic size controller & correction system
Automatic Dressing System
Process control and easy to driving by optimized program
Application
Silicon Wafer, SiC Wafer, Sapphire, Metals, Ceramics, Carbons,Glasses, Plastics, Composites
Specifications
| Model | unit | HRG-150 | VRG-250F | VRG-300F | VRG-500 |
| Wheel Spindle | 1.5kW 3,000rpm | 3.5kW 2,000rpm | 7.0kW 2,000rpm | 7.0kW 2,000rpm | |
| Work Spindle | 0.2kW 400rpm | 0.75kW 200rpm | 1.5kW 200rpm | 2.2kW 200rpm | |
| Work piece size | mm | Ø150 | Ø250 | Ø300 | Ø500 |
| Useable stroke | mm | 70 | 100 | 100 | 130 |
| Grinding speed | mm/min | 0.0001~1 | 0.0001~1 | 0.0001~1 | 0.0001~1 |
| Resolution | mm | 0.0001 | 0.0001 | 0.0001 | 0.0001 |
| Accuracy | mm | ±0.001 | ±0.001 | ±0.001 | ±0.002 |
| Repeating accuracy | mm | ±0.001 | ±0.001 | ±0.001 | ±0.001 |
| Automatic THK Measuring | N/A | N/A | Option | Option | |
| Automatic Dressing | Option | Option | Option | Option | |
| Dimension | mm | 1400*780*1520 | 1400*780*1520 | 1200*1050*1970 | 1300*1400*2100 |
| Weight | kg | 1,400 | 1100*950*1970 | 1,750 | 2,000 |
